Tag: SMT quality

S8080 3D Solder Paste Inspection (SPI). Measures volume, height, and area on every pad before component placement. Catches printing defects early — the cheapest fix in the entire SMT process.

JCX-830 SMT first article inspection system. Compares assembled board against CAD — verifies every component value, polarity, orientation & placement. Catches BOM errors before they become production defects.

On/off AOI machine. Automated optical inspection after every reflow cycle. Multi-angle lighting catches 50+ defect types — bridges, insufficient solder, tombstoning, lifted leads, missing components.